Vapor Chamber

Category: Advanced Packaging & 3D IC Material

Exhibitor: T-GLOBAL TECHNOLOGY CO., LTD.

Booth No: L526

Characteristic

A vapor chamber, sometimes called a flat heat pipe, uses a flat format of two-phase cooling with high heat transfer capability. For electronic cooling applications, the heat energy transfer is usually done on a heat sink very close to the heat source; making the vapor chamber assembly ideal for diffusing high heat density or heat load over a larger surface. By using a vapor chamber, you can expect increased and more uniform heat dispersion, which is ideal for optimizing the performance of the heat sink.The use of vapor chamber has increased significantly because the total power and the resulting power density have increased dramatically as a result of the reduced chip size. In terms of price and application flexibility, today's vapor chambers are more capable and less costly than they were a decade ago.

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Vapor Chamber

Characteristic

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