3D Stress Inspection & Analysis System for WBG Materials

Model: JadeSA-WBG / SP3055S

Category: Compound Semiconductor Equipment

Booth No: N214

Characteristic

JadeSA-WBG is a non-contact whole-wafer/MicroArea 3D Stress Inspection and Analysis System for WBG Materials, which helps establish the causal relationship from the material-end to the device-end and improves yield, output, performance, and component reliability.

【Features】
● Advanced 3D Raman inspection technology
● Effectively reflect the intrinsic property of WBG materials ‒ stress distribution on surface and in depth
● Capable of providing the percentage of unexpected polytype in the wafer
● Capable of performing whole wafer scan at specific depth with stress mapping
● Capable of performing MicroArea 3D stress mapping
● Capable of performing 3D polytype analysis
● Suitable for monitor the stress distribution and polytype uniformity of SiC substrate, homogeneous and heterogeneous epi wafer, and device process review
● Applied to 2”, 4”, 6”, 8” substrates