Single Wafer Soak and Spary System
Model: Sirius 2124 / Sirius 3024 / Sirius 3224
Category: Semiconductor Package Equipment
Exhibitor: SCIENTECH CORPORATION
Booth No: N303
Characteristic
Integrate soaking tank & spray chamber into same system.
Suitable for dryer film removal or metal lift off process.
Independent chemical circulation nsystem may able to maintain steady temperature control with high recycling ratio.
Recycle/Fresh chemistry delivery sequence can be programable to achieve cost reduction for chemical usage.
Both wafer frontside/backside can be spray cleaned.
Vertical soak + horizontal spin & spray to avoid cross contamination while wafer during transfer.
Supporting bridge size wafer as 6"/8" or 8"/12" can be operated in equipment without swap special jig or parts replacement.
Comply SEMI-S2 guidline
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