Multi Laser Lift Off Equipment (U/Excimer Laser)
Model: Invisi LUM-XML Series
Exhibitor: SHIN-ETSU SILICONE TAIWAN CO., LTD.
Booth No: L218
Characteristic
This equipment enables damage-less and high-throughput micro-LED chip transfer from sapphire wafer to 1st donor plate by laser irradiation.
Suitable for both Contact-LLO and Gap-LLO (pitch-conversion transfer of chips).
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