Zymet Underfill Encapsulants

Category: Advanced Packaging & 3D IC Material

Booth No: L222

Characteristic

Edgebond adhesives, sometimes referred to as Corner Glues or Cornerbond Adhesives, are an excellent alternative to board-level underfills. Process cost is reduced by the elimination of board preheat and capillary flow. Quality is improved because voids and incompatibility with flux residues are moot. Rework is far easier, further reducing cost. Zymet's reworkable edgebond adhesives provide all this, as they ruggedize and enhance the board level reliability of challenging electronic assemblies, even for enterprise and automotive applications.

Features:
Reworkable
SAC / Low Temperature Solder Assembly
Enhance Board Level Reliability (BLR)
Improve Shock and Drop Reliability
High Tg and Low CTE for the most challenging assemblies and applications
Fast, in-line curing with cure time as short as 1 minute

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Zymet Underfill Encapsulants

Characteristic

Other Products

Products you may be interested in

Highest Rated Products