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Super Thin Copper Foil for IC substrate

Category: Industrial Material - Advanced Packaging & 3D IC Material

Exhibitor: TOP NANOMETAL CORPORATION

Booth No: L110

Characteristic

Super Thin Copper Foil for IC substrate is 3um copper which covered with 18um copper foil. It is extremely easy to peel off once apply.

The customer will laminate the carrier copper and PP film and then peel off the 18um carrier copper foil, leaving only the peelable ultra-thin copper foil to be used as the Seed Layer in the IC substrate.

*Suitable for PCB mSAP process, can be used as thin circuit substrate application.
*Suitable for Substrate Like PCB, IC Substrate, high-density interconnect technology boards, IC package process materials, etc.

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