Ultra Thin 2Layer FCCL

Booth No: L110

Characteristic

This product is one of main upstream materials of Flexible Printed Circuit & Rigid-flex board. 2Layer FCCL without adhesive between PI and copper, can be used for advanced FPC manufacturing, such as fine pitch FPCs and tape COF FCCLs.

Using Roll to Roll vacuum sputtering and chemical electroforming(electroplating) processes. Copper thickness is between 2um and 8um, suitable for fine pitch (Pitch<40um) layout design. Single Side can up to 9um to 18um copper layer. Grain analysis : The crystalline particles, pores and surface roughness (Rq) of the copper layer are all smaller than ED Copper and RA Copper.

It has a finer grain distribution range and average value, and the material surface is very smooth. RoHS Compliant.

Menu

Ultra Thin 2Layer FCCL

Characteristic

Other Products

Products you may be interested in

Highest Rated Products