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Laser assisted die bonding

Model: NCB-series

Category: Display & Solution - Mini & Micro LED

Exhibitor: STROKE PRECISION ADVANCED ENGINEERING CO., LTD.

Booth No: M512

Characteristic

*Capacity:
+40k/hr @Pitch 1 mm
<6s per die(Repair mode, random pitch)
<4s per die(Debond mode, random pitch)
*Accuracy: +/-10um
*Minimum chip size: 0305 mil.
*Support multi-functions switch.
1.de-bond module
2.solder paste dispensing module
3.repair-module
*Without reflow oven, soldering print, auxiliary material.
*Lower operation cost.

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