Bonding/Debonding Equipment
Model: Invisi LUM-XBD Series
Category: Display & Solution - Mini & Micro LED
Exhibitor: SHIN-ETSU SILICONE TAIWAN CO., LTD.
Booth No: L228
Characteristic
Assured and high-precision collective chip transfer from Shin-Etsu Donor Plate to Shin-Etsu Release Plate.
Collective transfer available for various shapes of chips. Automation of debonding process.
Other Products
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Laser Mass Transfer Equipment (U/Excimer Laser)
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Donor Plate (SQDP Series)
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Large Size (2nd) Donor Plate (SQDP-G Series)
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Release Plate SQRP Series
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Stamp for micro LED chip transfer / Large size(6 inch)
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Multi Laser Lift Off Equipment (U/Excimer Laser)
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Dot stamp (Dot / 1-Dot / Dot-Large 6 inch) for micro LED chip transfer
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High-Speed Repair Equipment (Trimming/Repair Equipment)
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