Bonding/Debonding Equipment
Model: Invisi LUM-XBD Series
Category: Display & Solution - Mini & Micro LED
Exhibitor: SHIN-ETSU SILICONE TAIWAN CO., LTD.
Booth No: L228
Characteristic
Assured and high-precision collective chip transfer from Shin-Etsu Donor Plate to Shin-Etsu Release Plate.
Collective transfer available for various shapes of chips. Automation of debonding process.
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