SCIENTECH CORPORATION

 

Booth No: M325

Website: https://www.scientech.com.tw/

 

Exhibitor Profile

 

Being a leading semiconductor equipment and wafer reclaim supplier in Taiwan, Scientech has successively supported customers in LED, Mini/Micro LED, compound semi and power components such as IGBT, SiC and GaN industries, as well as advanced packaging process such as Bumping, Fan-out, Chip-On-Wafer and so on. Our wet process equipment has been successfully verified in the latest Chiplet's 2.5D/3D packaging process technology and smoothly introduced into mass production.

 

Brands

 

Scientech/Pactech/Sanyoseiko/ZEISS/KLA/MDC

 

Exhibit Products

 

• 

  Plating & Bonder/Debonder for FOPLP & ABF Substrate

 

Exhibitor Press Release

 

• Scientech wet process equipment for advanced technology has been continued to improve its production 2023-03-14

 

 

 

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