Moldex3D 2021 Unlocks Competitive Edge for Plastic Businesses
Exhibitor: CORETECH SYSTEM CO., LTD.(MOLDEX3D)
Booth No.: N230
Hsinchu, Taiwan — April 27, 2021 — CoreTech System Co., Ltd. (Moldex3D) announced today the release of Moldex3D 2021 – the latest version of its molding analysis software series. The new generation of Moldex3D continues to refine simulation capabilities to provide better user experiences. More powerful analysis modules are also incorporated in the system to meet different customer needs across industries. In response to a faster changing market in the Industry 4.0 era, Moldex3D 2021 helps businesses realize seamless design and manufacturing integration, producing world-class products within stricter time limits.
The important updates and highlights of Moldex3D 2021 are as follows:
Simulation Reports Are More Accurate and Customized
For common shrinkage and warpage prediction of injection molding, Moldex3D 2021 combines the material and stress characteristics of plastic phase changes in the packing stage, highly increasing the prediction accuracy. Furthermore, mechanical property simulation is introduced to optimize the calculation accuracy of short fiber materials, enabling users to receive better results of warpage prediction of fiber-filled materials. The curve construction and editing capabilities are also enhanced to generate higher-quality mesh with greater success rate and efficiency. With the newly added Nozzle Zone Wizard as well as the upgraded Gate, Runner and Cooling Channels Wizards, users are able to optimize designs with parameters and automatic mesh generation, making design validations easy and precise.
|Shrinkage and Warpage Prediction Accuracy Enhancement||Nozzle Zone Wizard|
Different analysis reports are required based on mold characteristics. Users can use Studio 2021 to customize their report format and choose which items to display.
Seamless Integration of Virtual and Reality. Access Every Data at Your Fingertips
Nowadays, enterprises emphasize more on data cloudization and digitalization. However, how to integrate virtual and real data is a challenging task. With Moldex3D iSLM, users can manage, share, and compare mold trial results and molding analysis through a simple click using their laptops or smart phones. Information can be accessed anytime, anywhere.
Moldex3D 2021 has also optimized the efficiency of submission process and parallel processing on Linux HPC (High Performance Computing). Engineers can run molding simulation efficiently on the remote Linux HPC cluster, on private or on public cloud, making it possible to analyze and calculate millions of elements in minutes.
Linux Remote Calculation Accelerated
Enhanced Accuracy in Advanced Process and Composite Materials. Meet and Surmount Demands from Rapidly Changing Industry
The market always pursues progress. Advanced process simulation needs to be more precise. Moldex3D never stops constructing high-end advanced process prediction capabilities, assisting companies to be more competitive in product development and optimization. Moldex3D’s non-matching mesh technology reduces the mesh generation time and improve the accuracy for RTM (Resin Transfer Molding) simulation of multi-layer fiber mat draping design. The new physical foaming capabilities provide a new microscopic foaming prediction model, which greatly increases the prediction precision of the existing modules of different foaming processes.
In addition to the above breakthroughs, Moldex3D 2021 also supports Fiber-mat thermoplastic continuous fiberboard composite simulation. By setting the continuous fiber material property values, users can analyze how fiber orientation impacts product quality and mechanical strength to further optimize their product designs.
Accuracy for RTM simulation improvement
Complete Support for IC Packaging Process Simulation. Flawlessly Respond to Every Detail
Due to the trend of intellectualization and electric vehicles, global industries have rising demand on reliable IC product performance. Advanced IC packaging technology plays an increasingly critical role in manufacturing process. Moldex3D’s new potting simulation capabilities are now available for IC packaging users. The Pre-processing Wizard can quickly generate high-quality mesh, which saves model preparation time and helps users validate IC packaging design, reducing trial and error costs significantly.
Studio fully supports all process types of IC Packaging simulation
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