Shin-Etsu Polymer presents new product "Panel FOUP" for FoPLP (Fan-out Panel Level Process).
Exhibitor: SHIN-ETSU POLYMER HONG KONG CO., LTD.
Booth No.: N1013
Shin-Etsu Polymer, an industry leader in semiconductor related products. With high precision manufacturing technology, Shin-Etsu Polymer develop and supplies FOUP/FOSB/Panel FOUP worldwide through corporate's global network.
In 2021 Touch Taiwan show, Shin-Etsu Polymer presents new product "Panel FOUP" for FoPLP (Fan-out Panel Level Process) to the world. With new published SEMI standard (E181, E181.1~E181.4), we provide a common platform for the semiconductor market to have best compatibility.
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