DNP Vapor Chamber
Exhibitor: DNP TAIWAN CO., LTD.
Date: 2023-03-24
Booth No.: L310
Vapor Chamber
Vapor Chambers are a type of "metal heat-dissipating component" similar to heat pipes, with the ability to instantly transfer heat by the vaporization and condensation of liquids. Compared to the graphite sheets commonly used in thin electronic devices, they have a higher thermal conductivity and can diffuse and dissipate that heat in an instant. As 5G compatible devices are anticipated to become more widespread, there is a need for heat dissipation solutions for electronics such as application processors and integrated circuits used for communication due to the increase in the data processing of those high-capacity, and high-speed communications. Vapor Chambers are expected to play an active role as a solution for the heat management of miniaturized electronic devices for which thinner, high-performance, power-saving thermal components are required. DNP has achieved the development of a thin Vapor Chamber that incorporates high thermal conductivity, and the flexibility to be applied to uniquely shaped spaces.
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