VP, Sales and Business Development, Asia, Oxford Instruments Plasma Technology
Oxford Instruments Plasma Technology
Plasma polish solution to prepare Epi-ready SiC substrates for Power Applications
Education:
BTech Mechanical Engineering, Loughborough Univ., UK
Experience:
Senior Director Regional Marketing for Asia, SPTS
Asia Regional Sales Director, STS
As VP of Sales and Business Development, Ian joined Oxford Instruments in 2016 from SPTS and has now been in the industry for over 35 years, being especially involved in the development and marketing of plasma solutions for the MEMS, Optoelectronics and Packaging markets and more recently, whilst at Oxford Instruments prioritising the WBG power segment for etch and ALD process solutions. He was one of the original team to bring the ‘Bosch’ Silicon DRIE to market in the mid 90’s whilst at STS.
He is in charge of all sales and business development activities for Oxford Instruments’ plasma solutions across the region from Turkey in the West all the way across to Japan in the East and during this time his team has expanded the equipment solutions business by over 400%. Ian has been based in Singapore for almost 20 years.
Silicon Carbide (4H-SiC) is an ideal wide bandgap semiconductor for high-voltage (>1.2kV) power applications, because of its unique material properties. However, with these unique properties come processing challenges, with development required to maintain high yield, and high substrate costs which contribute significantly to device costs. Oxford Instruments has developed and launched their Plasma Polish process, a contactless and scalable surface polishing process on their existing PlasmaPro 100 etch platform. Plasma Polish is designed to prepare SiC wafers for epi, with other adjacent applications also in development, which addresses cost and quality challenges throughout the SiC device production process flow. During the talk, Ian will share their progress on the productization of this contactless SiC polishing process.